Fracture in a thin film of nanotwinned copper

Fracture in a thin film of nanotwinned copper

Fracture toughness and fatigue crack growth characteristics of nanotwinned copper

Recent studies have shown that nanotwinned copper (NT Cu) exhibits a combination of high strength and moderate ductility. However, most engineering and structural applications would also require materials to have superior fracture toughness and prolonged subcritical fatigue crack growth life. The current study investigates the effect of twin density on the crack initiation toughness and stable ...

Copper–titanium thin film interaction

Interaction between 5 lm thick copper and 50 nm thin titanium films was investigated as a function of annealing temperature and time using MeV He Rutherford backscattering, X-ray diffraction and dynamic Secondary Ion Mass Spectrometry. Samples were made by depositing 10 nm of titanium on a PECVD silicon oxynitride, followed by 50 nm of titanium nitride and 50 nm of titanium in the said order. I...

Transverse fracture in thin-film coatings under spherical indentation

The competition between transverse surface and sub-surface cracks in a thin, hard coating bonded to polycarbonate substrate due to spherical indentation is investigated in real-time as a function of coating thickness and indenter radius. Fine grain (Y-TZP) and medium grain (alumina) ceramics and pre-abraded amorphous glass are used for the coating. As the coating thickness is reduced, the famil...

Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The primary mechanism is the thermodynamic work of adhesion of the interface, which in its most basic description is the difference between the surface energies of the two materials and that of the interface. This quantity is often described as leveraging the contributions of other mechanisms. One of...